Phase shifter for laser annealing

ABSTRACT

An object of the present invention is to provide a phase shifter for laser annealing which is capable of effectively preventing the sticking of particles. A first layer and a third layer are made of quartz glass, and a two-dimensional pattern of fine grooves is formed in the surfaces of the layers. The first layer and the third layer are arranged so that a second layer is sandwiched between the layers in a state in which the surfaces provided with the grooves face each other. A peripheral edge portion of the first layer is laminated on that of the third layer by a spacer. The second layer is made of an inactive gas introduced between the first layer and the third layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromprior Japanese Patent Application No. 2005-165476, filed Jun. 6, 2005,the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a phase shifter for use in irradiatinga substrate to be treated with a luminous flux having a predeterminedintensity distribution by use of interference of laser light havingdifferent phases. This phase shifter is used, for example, during laserannealing performed in order to grow crystal grains in a specific areaof the surface of a substrate to be treated, when a thin film transistoris formed on the surface of the substrate to be treated.

2. Description of the Related Art

In a display device such as an active matrix type liquid crystal deviceor an organic electroluminescent display device, a large number of thinfilm transistors (TFTs) are formed on an insulating substrate made ofglass, plastic or the like in order to individually drive pixels. As toan amorphous silicon (a-Si) film for use in source, drain, and channelareas of the TFT, since a forming temperature is low, the film can becomparatively easily formed by a vapor phase growth process, and massproductivity is also satisfactory, the film has been broadly used as asemiconductor thin film for forming the TFT.

However, the amorphous silicon film has a disadvantage that the film isinferior to a polycrystal silicon (poly-Si) film in physical propertiessuch as conductivity (mobility of a-Si is lower than that of poly-Si bytwo or more digits). Therefore, it is necessary to establish a method offorming the source, drain, and channel areas of the TFT in thepolycrystal silicon film in order to increase an operation speed of theTFT thereafter.

In the present situations, as a method of forming the polycrystalsilicon film, for example, there is used an annealing process(hereinafter referred to as the excimer laser annealing [ELA] process)using excimer laser. The ELA process is applicable to various processesother than the forming of polycrystal silicon, when an average intensity(fluence) of the laser light is changed. For example, when the intensityof the laser light is set to a region having an only heating function,the process is usable in an impurity activation process required forforming the TFT. When the intensity of the laser light is excessivelyincreased, a rapid temperature rise is caused, and therefore the processis usable for removing the film from the TFT. It is to be noted that theuse of these phenomena is not limited to the TFT, and the phenomena arebroadly applicable to a semiconductor manufacturing process.

This ELA process can be carried out in a temperature region (i.e., fromroom temperature to about 500° C.) in which a versatile glass substrateis usable (Matsumura, Surface Science Vol. 21, No. 5, pp. 278 to 287,2000). In the ELA process, for example, after depositing an amorphoussilicon film in a predetermined thickness (e.g., about 50 nm) on asubstrate, the amorphous silicon film is irradiated with kryptonfluoride (KrF) excimer laser light (wavelength 248 nm), xenon chloride(XeCl) excimer laser light (wavelength 308 nm) or the like. Theamorphous silicon film is locally molten, recrystallized, and changedinto the polycrystal silicon film having an average particle diameter ofabout 0.1 to 0.2 μm.

It has been clarified that the polycrystal silicon film has itslimitation in order to increase the operation speed or improveperformance in a display device such as a liquid crystal display deviceor the organic electroluminescent display device. This is because alarge number of crystal grain boundaries existing in an active layerremarkably increase fluctuations in a threshold voltage (Vth) of theTFT, and remarkably degrade operation characteristics in a case wherethe TFT is prepared using polycrystal silicon. Therefore, it has beendemanded that the crystal grain boundaries of the active layer of eachTFT be controlled or that crystals be grown to have large particlediameters to thereby remove the crystal grain boundaries.

The present inventors have investigated a method of setting a crystaldiameter to be sufficiently larger than a TFT size and controllinggenerated positions of the crystal grains to thereby remove the crystalgrain boundary from the active layer of the TFT. In this method, anoptical device (hereinafter referred to as the phase shifter) formodulating a phase of the laser light is inserted midway in an opticalpath in which the amorphous silicon film is irradiated with the laserlight, and a light intensity distribution of the laser light on theamorphous silicon film is adjusted into an appropriate shape to therebyincrease the grain diameters (lateral crystal growth). As a result, atechnology has been developed which is capable of controlling theposition of a silicon single crystal having a large grain diameter ofabout two to seven microns to thereby realize lateral crystal growth.Furthermore, it has been found that in order to stably crystallize thefilm having a desired grain diameter, the light intensity distributionof the laser light with which the amorphous silicon film is irradiatedin a micro region having a submicron level is particularly important forthe crystallization in which the positions of the crystal grains havinglarge diameters are controlled.

Since a light intensity gradient on the surface of the substrate to betreated is an important factor for the growth of the crystal grains, asectional structure and a surface state of the phase shifter for formingthe light intensity distribution are important. Additionally, particles(dust) easily stick to an uneven surface of the phase shifter. This isbecause the phase shifter is generally made of an insulating materialsuch as glass, static electricity is therefore frequently generated,and, as a result, the particles in the atmosphere are attracted.

Since the stuck particles interrupt the laser light or disturb phaseinformation, the following problem arises. That is, since the lightintensity distribution is disturbed by the particles, unintended drop orrise of the light intensity distribution is generated. As a result, thelateral growth of the crystal whose position has been controlled isobstructed. When the particles are burnt on the surface of the phaseshifter by irradiation with high-energy laser, the life of the phaseshifter is reduced. It is considered that a device be devised in orderto remove the particles (e.g., air is sprayed to the surface of a mask),but it is not possible to easily remove the particles stuck onto anuneven portion by the static electricity.

BRIEF SUMMARY OF THE INVENTION

The present invention has been developed in view of the above-describedproblems of the conventional phase shifter for laser annealing, and anobject of the present invention is to provide a phase shifter for laserannealing to which particles are not easily stuck and which is capableof minimizing influences of the stuck particles.

The present invention is a phase shifter for laser annealing whichirradiates the surface to be treated with a luminous flux having aregular intensity distribution during the laser annealing, the shiftercomprising:

a first layer having a first refractive index in a wavelength of laserlight for use;

a second layer disposed on the first layer and having a secondrefractive index which is different from the first refractive index inthe wavelength of the laser light for use;

a third layer disposed on the second layer and having the firstrefractive index in the wavelength of the laser light for use; and

a spacer which is disposed between the first layer and the third layeralong peripheral edge portions of the first and third layers and whichblocks the second layer from the outside,

wherein a two-dimensional pattern of fine stepped portions is formed inat least one of an interface between the first layer and the secondlayer and an interface between the second layer and the third layer,whereby a phase difference is made between the laser light passedthrough the stepped portion and the laser light passed through a portionother than the stepped portion.

According to the phase shifter for laser annealing in the presentinvention, an optical path difference is generated between an opticalpath length of the laser light passed through the stepped portion andthat of the laser light passed through the portion (i.e., referencesurface) other than the stepped portion. The optical path differencecorresponds to a value obtained by multiplying a height (or depth) ofthe stepped portion by a difference between the first refractive indexand the second refractive index. This makes the phase difference betweenthe laser light passed through the stepped portion and that passedthrough the portion other than the stepped portion. When the laser lighthaving such phase difference interferes with each other on the surfaceto be treated, a distribution is generated in light intensity on thesurface to be treated.

Therefore, it is possible to irradiate the surface to be treated withlight having a regular intensity distribution by use of the phaseshifter for laser annealing in the present invention. Consequently, itis possible to control generation of a crystal nucleus and growth of acrystal grain on the surface to be treated, when a temperaturedistribution pattern is adjusted in a case where a thin filmconstituting the surface to be treated melts and is next recrystallized.

Furthermore, according to the phase shifter for laser annealing in thepresent invention, the interface between the first layer and the secondlayer and that between the second layer and the third layer are isolatedfrom the outside. Therefore, particles can be prevented from being stuckto the stepped portion. As a result, it is possible to inhibit theunintended drop or rise of the light intensity distribution, which isattributable to the particles. Generated positions and sizes of crystalgrains can be stably controlled. This eliminates a problem that theparticles are burnt in the stepped portion of the phase shifter byirradiation with a high-energy laser.

For example, the first and third layers are made of quartz glass, andthe second layer is made of an inactive gas.

Alternatively, the first and third layers are made of quartz glass, andthe second layer is made of porous silica.

In this case, the phase shifter for laser annealing preferably has atransmittance of 80% or more in the wavelength of the laser light foruse.

Preferably, in order to prevent the interference of the laser lightbetween two interfaces close to each other, a thickness d of the secondlayer is set to satisfy the following equation:d≧λ ²/Δλ,wherein λ denotes the wavelength of the laser light, and Δλ denotes anoscillation spectrum width.

It is to be noted that instead of constituting the phase shifter forlaser annealing of three layers as described above, the shifter may beconstituted of two layers.

In this case, a phase shifter for laser annealing in the presentinvention comprises:

a first layer having a first refractive index in a wavelength of laserlight for use; and

a second layer disposed on the first layer and having a secondrefractive index which is different from the first refractive index inthe wavelength of the laser light for use,

wherein a two-dimensional pattern of fine stepped portions is formed inan interface between the first layer and the second layer, whereby aphase difference is made between the laser light passed through thestepped portion and the laser light passed through a portion other thanthe stepped portion.

Also in this case, the phase shifter for laser annealing preferably hasa transmittance of 80% or more in the wavelength of the laser light foruse.

Moreover, in the present invention, a laser anneal apparatus whichirradiates a semiconductor thin film with a luminous flux having aregular light intensity distribution to crystallize the semiconductorthin film, the apparatus comprising:

a laser light source;

an illumination system which converges laser light emitted from thelaser light source onto a focal point;

a phase shifter disposed in the focal point of the illumination system;and

an image-forming optical system disposed between the phase shifter andthe semiconductor thin film,

wherein the phase shifter for laser annealing, provided with anysectional structure described above, is used as the phase shifter.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a schematic diagram showing an example of a cross-sectionalstructure of a phase shifter for laser annealing in the presentinvention;

FIG. 2 is a schematic diagram showing another example of across-sectional structure of a phase shifter for laser annealing in thepresent invention;

FIG. 3 is a schematic diagram showing still another example of across-sectional structure of a phase shifter for laser annealing in thepresent invention;

FIG. 4 is a schematic diagram showing a further example of a sectionalstructure of a phase shifter for laser annealing in the presentinvention;

FIG. 5 is a diagram showing a schematic constitution of a laser annealapparatus using a phase shifter for laser annealing in the presentinvention;

FIG. 6 is a schematic diagram of a dark-field photograph showing atissue crystallized using the phase shifter for laser annealing in thepresent invention (a case where there is not any interference); and

FIG. 7 is a schematic diagram of a dark-field photograph showing atissue crystallized using the phase shifter for laser annealing in thepresent invention (a case where there is the interference).

DETAILED DESCRIPTION OF THE INVENTION EMBODIMENT 1

FIG. 1 shows a schematic sectional structure of a phase shifter forlaser annealing in the present invention. In the drawing, referencenumber 1 denotes a first layer, 2 denotes a second layer, and 3 denotesa third layer.

The first layer 1 and the third layer 3 are made of, for example, quartzglass. A two-dimensional pattern is formed with a fine grooves 5(stepped portions) in the surface of the first layer 1. Similarly, atwo-dimensional pattern is formed with fine grooves 6 (stepped portions)in the surface of the third layer 3. The first layer 1 and the thirdlayer 3 are arranged so that the second layer 2 is sandwiched betweenthe first layer and the third layer in a state in which the surfacesprovided with the grooves 5, 6 face each other. A peripheral edgeportion of the first layer 1 is laminated on that of the third layer 3via a spacer 4.

In this example, the second layer 2 is constituted of an inactive gasintroduced between the first layer 1 and the third layer 3. The surfaceof the spacer 4 is polished to a mirror face. A material of the spacer 4may be a metal such as aluminum, chromium, or stainless steal, quartz,or glass. The spacer 4 preferably has a thermal expansion coefficientequal to that of a phase shifter if possible. This prevents breakage ofthe phase shifter caused by a temperature rise accompanying transmissionof intense laser light. Each layer is preferably bonded to the spacer 4by optical contact (bonding under pressure by the mirror-facepolishing). This bonding may also be performed using silicone oil orepoxy agent. In this case, attention needs to be paid to prevent bondedsurface from being introduced into an optical path of the laser light.In the second layer 2, instead of the inactive gas (e.g., N₂, He, Ne orthe like), clean air may be used depending on an intensity of laserlight.

As to arrangement and sectional shapes of the grooves 5 and 6 in thesurfaces of the first layer 1 and the third layer 3 in a sectionperpendicular to each of the layers 1 to 3 shown in FIG. 1, there is amirror-face symmetric relation between the two layers between which acentral symmetric face is sandwiched.

It is to be noted that in this example, an interval d (value in a bottomportion of the grooves 5, 6) between the first layer 1 and the thirdlayer 3 is designed to 60 μm in consideration of performance of aprojection lens. A reason why the interval is disposed between the firstlayer 1 and the third layer 3 is that if this interval is excessivelysmall, interference occurs while the laser light passes through theinterval. Such interference can be prevented, when the above interval dis set to satisfy the following equation:d≧λ ²/Δλ,wherein λ denotes a wavelength of the laser light, and Δλ denotes anoscillation spectrum width of the laser light. It is to be noted thatthe problem of such interference of the laser light will be describedlater in detail.

EMBODIMENT 2

FIG. 2 shows another example of a cross-sectional structure of a phaseshifter for laser annealing in the present invention. A sectional shapeof each layer is the same as that of the above example shown in FIG. 1.

In this example, a first layer 1 and a third layer 3 are made of quartzglass, and a second layer 2 b is made of porous silica (e.g., trade name“Silica Aerogel” manufactured by U.S. Aerogel Inc.). Porous silica has alight refractive index of 1.01 to 1.06, which is remarkably close tothat of air. There is a sufficient difference from quartz glass(refractive index: 1.45) constituting the first layer 1 and the thirdlayer 3. Furthermore, porous silica has a comparatively hightransmittance of about 80% with respect to the laser light (wavelength:248 nm) emitted from KrF excimer laser, and decay of the laser lightpassed through the phase shifter can be minimized.

This phase shifter will be assembled as follows. Porous silica issandwiched between the first layer 1 and the third layer 3, and apressing load is applied between these layers. Next, a spacer (notshown) is attached between the first layer 1 and the third layer 3 alongperipheral edge portions of the first layer 1 and the third layer 3.Subsequently, the spacer is bonded to the first layer 1 and the thirdlayer 3. In consequence, a space between the first layer 1 and the thirdlayer 3 is blocked to prevent entrance of particles. The particles aregenerated by ablasion of a substrate surface at a time when a substrateto be treated is irradiated with the laser light. Such particles arescattered in the apparatus, and there is a fear that they reach theperiphery of the phase shifter.

EMBODIMENT 3

FIG. 3 shows still another example of a sectional structure of a phaseshifter for laser annealing in the present invention. This example is amodification of the above example shown in FIG. 1. In this example, athird layer 3 c is constituted of a flat plate of quartz glass. That is,any two-dimensional pattern of fine stepped portions is not formed in aninterface 6 c between a second layer 2 c and the third layer 3 c.Another respect is similar to that of the above example shown in FIG. 1.

EMBODIMENT 4

FIG. 4 shows a further example of a sectional structure of a phaseshifter for laser annealing in the present invention. In this example,the phase shifter is constituted of two layers, that is, a first layer11 and a second layer 12, and a two-dimensional pattern is formed withfine grooves 15 in an interface between two layers 11 and 12.

In this example, the first layer 11 is made of quartz glass, and thesecond layer 12 is porous silica described above. Two layers are bondedto each other by application of a pressing load. Peripheral edgeportions are bonded to each other with an adhesive (not shown) in theinterface between the first layer 11 and the second layer 12.

EMBODIMENT 5

FIG. 5 shows an outline of a laser anneal apparatus for use incrystallizing a semiconductor thin film by use of a phase shifter forlaser annealing in the present invention. In the drawing, referencenumber 31 denotes a semiconductor thin film, 40 denotes a laser lightsource, 41 denotes an illumination system, 45 denotes a phase shifter,and 46 denotes an image-forming optical system.

The semiconductor thin film 31 is deposited on the surface of asubstrate 30 to be treated. The substrate 30 to be treated is held on asubstrate stage 32. The illumination system 41 is provided with anattenuator 42 and a homogenizer 43. The image-forming optical system 46is provided with a first condenser lens 47, an aperture 48, and a secondcondenser lens 49.

An intensity (laser fluence) of laser light emitted from the laser lightsource 40 (e.g., KrF excimer laser) is adjusted by the attenuator 42,and a two-dimensional distribution of intensities is homogenized in thehomogenizer 43. Thereafter, the light enters the phase shifter 45. Theface of the phase shifter 45 in which stepped portions is formed isdisposed in a focal position of the illumination system 41. The laserlight whose phase has been modulated through the phase shifter 45 passesthrough the image-forming optical system 46 to enter the substrate 30 tobe treated. The semiconductor thin film 31 on the surface of thesubstrate 30 to be treated is position in the focal position of theimage-forming optical system 46.

It is to be noted that as to a constitution of the homogenizer 43, asystem is generally adopted in which the laser light is split into aplurality of lights by use of a first fly eye lens, and thereafter thelaser lights are superimposed upon one another by use of a second flyeye lens to thereby form a homogeneous light intensity.

The image-forming optical system 46 reduces the light passed through thephase shifter 45, and forms the light into an image on the surface ofthe substrate 30 to be treated. A pattern of the light intensitydistribution formed by the phase shifter 45 is two-dimensionally reducedby the image-forming optical system 46, and projected on the surface ofthe substrate 30 to be treated. Reduction by the image-forming opticalsystem 46 is, for example, one fifth. In this manner, the semiconductorthin film 31 on the surface of the substrate 30 to be treated can bemolten using laser light having a predetermined light intensitydistribution pattern, next solidified, and accordingly crystallized.

Next, there will be described the problem of the laser lightinterference in the phase shifter having the cross-sectional structureshown in each of FIGS. 1 to 3.

Laser space coherency is defined by λ²/Δλ, wherein λ denotes awavelength of the laser light, and Δλ denotes a half-value width (FWHM)of the laser wavelength. The interference occurs in a case where a spacethickness is smaller than this value. Therefore, in the phase shifterhaving an intermediate layer (second layer 2, 2 b, or 2 c) shown in eachof FIGS. 1 to 3, assuming that an interval between the first layer 1 andthe third layer 3 is d, d≧λ²/Δλ needs to result.

To confirm this, an experiment was carried out using the phase shifterprovided with the sectional structure shown in FIG. 3 and the laseranneal apparatus shown in FIG. 5. In this experiment, KrF excimer laserwas used in the laser light source 40. As a result of measurement, thislaser had a wavelength of 0.248 μm. Moreover, Δλ was about 0.0007 μm.Therefore, a coherence length was about 87.9 μm.

To verify whether or not this value was adequate, the semiconductor thinfilm was crystallized by the laser annealing by use of the phase shifterin which d (FIG. 3) was set to 30 μm and 110 μm. The laser light fluencewas set to about 700 mJ/cm². It has been confirmed that either of theinterface between the first layer 1 and the second layer 2 c of thephase shifter and the interface between the second layer 2 c and thethird layer 3 c is in a range of a depth of focus (DOF) of theimage-forming optical system.

When the surface of the laser-annealed substrate to be treated wasobserved, a fine regularly striped pattern was observed in a dark-fieldphotograph taken with an optical microscope as shown in a schematicdiagram of FIG. 6 in the substrate 30 laser-annealed using the phaseshifter in which d=110 μm was set. This striped pattern is constitutedof an area (black band-like portion) crystallized in accordance with thepattern of the stepped portion of the phase shifter. There was notobserved any abnormality supposedly attributable to the interference ofthe laser light in the interval.

On the other hand, in the substrate 30 laser-annealed using the phaseshifter in which d=30 μm was set, as shown in a schematic diagram ofFIG. 7, in addition to a striped pattern similar to that of the aboveexample, there was observed a coarsely striped pattern having a pitch ofabout 120 μm in a state in which the pattern crossed the above patternat about 75 degrees in a dark-field photograph by an optical microscope.This second striped pattern is constituted of an area having a differentcrystallized state, and corresponds to interference fringes.

1. A phase shifter for laser annealing which irradiates the surface tobe treated with a luminous flux having a regular intensity distributionduring the laser annealing, the shifter comprising: a first transparentlayer having a first refractive index in a wavelength of laser light foruse; a second transparent layer disposed on the first transparent layerand having a second refractive index which is different from the firstrefractive index in the wavelength of the laser light for use; a thirdtransparent layer disposed on the second transparent layer and havingthe first refractive index in the wavelength of the laser light for use;and a spacer which is disposed between the first transparent layer andthe third transparent layer along peripheral edge portions of the firstand third transparent layers and which blocks the second transparentlayer from the outside so as to prevent particles from entering betweenthe first transparent layer and the third layer, wherein atwo-dimensional pattern of fine stepped portions is formed in at leastone of an interface between the first transparent layer and the secondtransparent layer and an interface between the second transparent layerand the third transparent layer, whereby a phase difference is madebetween the laser light passed through the stepped portion and the laserlight passed through a portion other than the stepped portion, andwherein a thickness of the second transparent layer is selected so as toprevent interference of the laser light while the laser light passesthrough the second transparent layer.
 2. The phase shifter for laserannealing according to claim 1, wherein the first and third transparentlayers are made of quartz glass, and the second transparent layer ismade of an inactive gas.
 3. The phase shifter for laser annealingaccording to claim 1, wherein the first and third transparent layers aremade of quartz glass, and the second transparent layer is made of poroussilica.
 4. The phase shifter for laser annealing according to claim 3,having a transmittance of 80% or more in the wavelength of the laserlight for use.
 5. The phase shifter for laser annealing according toclaim 1, wherein a thickness d of the second transparent layer is set tosatisfy the conditions:d≧λ ²/Δλ, wherein λ denotes the wavelength of the laser light, and Δλdenotes an oscillation spectrum width.
 6. The phase shifter for laserannealing according to claim 1, having a transmittance of 80% or more inthe wavelength of the laser light for use.
 7. A phase shifter for laserannealing which irradiates the surface to be treated with a luminousflux having a predetermined intensity distribution during the laserannealing, the shifter comprising: a first transparent layer having afirst refractive index in a wavelength of laser light for use; and asecond transparent layer disposed on the first transparent layer so asto prevent particles from depositing on the first transparent layer, andhaving a second refractive index which is different from the firstrefractive index in the wavelength of the laser light for use, wherein atwo-dimensional pattern of fine stepped portions is formed in aninterface between the first transparent layer and the second transparentlayer, whereby a phase difference is made between the laser light passedthrough the stepped portion and the laser light passed through a portionother than the stepped portion, and wherein a thickness of the secondtransparent layer is selected so as to prevent interference of the laserlight while the laser light passes through the second transparent layer.